Funding Organization
DARPA
Principal Investigator
Johnson Samuel
Co-PIs
Fotios Kopsaftopoulos, Sandipan Mishra, John Wen, Semih Akin
Percent
10
Start Date
End Date
Amount
$1,000,000
Grant Status
Complete
Abstract
This project aima at developing a novel convergent manufacturing pathway to realize additively manufactured (AM), load-carrying, smart metallic structures that are capable of sensing three-dimensional temperature and strain fields during their operational lifetime.